Skip to product information

Kingston DDR4 260pin Non-ECC 2666MT/s / PC4-21300 CL19

HK$170.00
 per 
Shipping calculated at checkout.
Capacity

If we are unable to ship the product(s) due to out of stock or other reasons, our staff at BuyBuy.hk will contact you for refund arrangements.

Warranty will be provided by product supplier or manufacturer

Guaranteed authentic with local warranty
Free HK shipping on orders over HK$1,000

Product Information

4GB 4 CHIPS SO DIMM CL19 / 1.2V

This document describes ValueRAM's KVR26S19S6/4 as a 512M x 64-bit (4GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx16, memory module, based on four 512M x 16-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. This 260-pin SODIMM uses gold contact fingers. 

8GB 8 CHIPS

This document describes ValueRAM's KVR26S19S8/8 is a 1G x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, non-ECC, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. This 260-pin DIMM uses gold contact fingers.

16GB 8 CHIPS 

This document describes ValueRAM's KVR26S19S8/16 is a 2G x 64-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8, non-ECC, memory module, based on eight 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. This 260-pin DIMM uses gold contact fingers. 

32GB 16 CHIPS

This document describes ValueRAM's KVR26S19D8/32 is a 4G x 64-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 2Rx8, non-ECC, memory module, based on sixteen 2G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. This 260-pin DIMM uses gold contact fingers. 

FEATURES
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free

SPECIFICATIONS

CL(IDD) 19 cycles
Row Cycle Time (tRCmin) 45.75ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin) 32ns(min.)
Maximum Operating Power TBD W*
UL Rating  94 V - 0
Operating Temperature 0 to +85
Storage Temperature -55 to +100

*The above product descriptions are for reference only. The product information is subject to the official product website.

View full details

Kingston DDR4 260pin Non-ECC 2666MT/s / PC4-21300 CL19